EP4CGX110CF23C8N vs EP4CGX150CF23I6N Comparison

Detailed side-by-side comparison of EP4CGX110CF23C8N by Intel and EP4CGX150CF23I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110CF23C8N EP4CGX150CF23I6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 149760
Logic Array Blocks (LABs) 6,839 —
Embedded Memory (bits) 5,621,760 —
User I/O Count 270 —
Transceivers 4 channels —
Transceiver Data Rate (max) 3.125 Gbps —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Process Node 60 nm —
Core Voltage 1.2 V 1.2 V
Speed Grade C8 6
Operating Temperature 0 C to 85 C (commercial) -40C to +100C (Industrial)
Package 484-ball FBGA (F23) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level 3 —
Configuration Method Quartus Prime / JTAG / Active Serial —
Embedded Memory — 6635520 bits (6.6 Mbit)
User I/Os — 270 (per DigiKey listing) - 720 per family datasheet max
Number of Pins — 484
Package Type — FBGA (FineLine Ball Grid Array)
Process Technology — 60 nm
Transceiver Channels — 8 (up to 3.125 Gbps)
PLLs — 4
18x18 Multipliers — Up to 360
Memory Blocks — M9K (9 Kbit each)
Configuration Modes — JTAG, AS, PS, FPP
Hard IP Blocks — PCIe Gen1 (x1/x2/x4), memory controller

Datasheets & Resources

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