EP4CGX110CF23C8N vs EP4CGX150CF23I6N Comparación
Comparación detallada lado a lado de EP4CGX110CF23C8N por Intel y EP4CGX150CF23I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110CF23C8N | EP4CGX150CF23I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $170,45 | $175,80 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 149760 |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | — |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C8 | 6 |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | -40C to +100C (Industrial) |
| Encapsulado | 484-ball FBGA (F23) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Embedded Memory | — | 6635520 bits (6.6 Mbit) |
| User I/Os | — | 270 (per DigiKey listing) - 720 per family datasheet max |
| Número de pines | — | 484 |
| Package Type | — | FBGA (FineLine Ball Grid Array) |
| Process Technology | — | 60 nm |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| PLLs | — | 4 |
| 18x18 Multipliers | — | Up to 360 |
| Memory Blocks | — | M9K (9 Kbit each) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Hard IP Blocks | — | PCIe Gen1 (x1/x2/x4), memory controller |