EP4CGX110DF23I7N vs EP4CGX50DF23C6N Comparison
Detailed side-by-side comparison of EP4CGX110DF23I7N by Intel and EP4CGX50DF23C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF23I7N | EP4CGX50DF23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $182.00 | $52.30 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,839 | β |
| User I/O Pins | 270 | β |
| Embedded Memory | 4.4 Mbits (approximate) | 2,340 Kbits |
| Embedded 18x18 Multipliers | 56 | β |
| Transceivers | Up to 3.125 Gbps embedded transceivers | β |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | β |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Operating Temperature | -40C to +100C (industrial) | β |
| Speed Grade | 7 | β |
| Package | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | β |
| Package Code | BGA (FBGA) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | β |
| Configuration Memory | SRAM-based (volatile, requires external config device) | β |
| Configurable Logic Blocks (CLBs) | β | 3,118 |
| Core Voltage | β | 1.2 V |
| Number of Pins / Balls | β | 484 |
| Package Type | β | 484-ball FBGA (PBGA) |
| JEDEC Package Code | β | S-PBGA-B484 |
| User I/O | β | 218 |
| Transceiver Channels | β | Up to 8 |
| Maximum Transceiver Data Rate | β | 3.125 Gbps |
| Operating Temperature Grade | β | Commercial |
| Configuration Method | β | JTAG / Passive Serial / Active Serial |