EP4CGX110DF23I7N vs EP4CGX50DF23C6N Сравнение
Подробное сравнение бок о бок EP4CGX110DF23I7N от Intel и EP4CGX50DF23C6N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP4CGX110DF23I7N | EP4CGX50DF23C6N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $182,00 | $52,30 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 2,340 Kbits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Рабочая температура | -40C to +100C (industrial) | — |
| Speed Grade | 7 | — |
| Корпус | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | — |
| Package Code | BGA (FBGA) | — |
| Тип монтажа | Surface Mount | Surface Mount (BGA) |
| Статус RoHS | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Voltage | — | 1.2 V |
| Number of Pins / Balls | — | 484 |
| Package Type | — | 484-ball FBGA (PBGA) |
| JEDEC Package Code | — | S-PBGA-B484 |
| User I/O | — | 218 |
| Transceiver Channels | — | Up to 8 |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Operating Temperature Grade | — | Commercial |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |