EP4CGX110DF23I7N vs EP4CGX50DF23C6N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX50DF23C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX50DF23C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $52,30 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 2,340 Kbits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Speed Grade | 7 | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | — |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Voltage | — | 1.2 V |
| Number of Pins / Balls | — | 484 |
| Package Type | — | 484-ball FBGA (PBGA) |
| JEDEC Package Code | — | S-PBGA-B484 |
| User I/O | — | 218 |
| Transceiver Channels | — | Up to 8 |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Operating Temperature Grade | — | Commercial |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |