EP4CGX50CF23C7 vs EP4CGX50DF23C7N Comparison

Detailed side-by-side comparison of EP4CGX50CF23C7 by Intel and EP4CGX50DF23C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX50CF23C7 EP4CGX50DF23C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $55.10 $43.20
Family Cyclone IV GX Cyclone IV GX
Logic Elements 49,888 49,888
Logic Cells 49,888 β€”
Embedded Memory Bits 2,562,048 bits β€”
Embedded Memory Blocks M9K blocks, 9 Kbit each β€”
Maximum User I/O 290 β€”
Package 484-FBGA (F23) 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm)
Ball Pitch 1.0 mm β€”
Core Voltage 1.2 V β€”
Process Technology 60 nm 60 nm
Temperature Grade Commercial (0C to +85C) β€”
Speed Grade C7 β€”
Transceivers Integrated (Cyclone IV GX) Up to 8 channels, 3.125 Gbps
DSP Blocks 18x18 hardware multipliers β€”
RoHS Status Compliant Compliant (Pb-free variant)
Mounting Type Surface Mount (FBGA) Surface Mount
Configurable Logic Blocks (CLBs) β€” 3,118
Total RAM Bits β€” 2,432 Kbit (β‰ˆ 304 KB)
Embedded 18x18 Multipliers β€” 66
PLLs β€” 2
Global Clock Networks β€” 8 (with up to 16 clock pins per region)
Number of I/O Pins β€” 290
Core Supply Voltage (VCCINT) β€” 1.15 V to 1.25 V (nominal 1.2 V)
Operating Temperature β€” 0 Β°C to 85 Β°C (commercial)
Configuration Modes β€” Passive Serial (PS), Active Serial (AS), JTAG
Supported Memory Interfaces β€” DDR2 SDRAM, QDRII SRAM, RLDRAM II
MSL Level β€” 3 (168 hours)

Datasheets & Resources

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