EP4CGX50CF23C7 vs EP4CGX50DF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7 von Intel und EP4CGX50DF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7 | EP4CGX50DF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,10 | $43,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | — |
| Gehäuse | 484-FBGA (F23) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | — |
| Transceivers | Integrated (Cyclone IV GX) | Up to 8 channels, 3.125 Gbps |
| DSP Blocks | 18x18 hardware multipliers | — |
| RoHS-Status | Compliant | Compliant (Pb-free variant) |
| Montageart | Surface Mount (FBGA) | Surface Mount |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 (with up to 16 clock pins per region) |
| Number of I/O Pins | — | 290 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Betriebstemperatur | — | 0 °C to 85 °C (commercial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| MSL-Level | — | 3 (168 hours) |