EP4SGX360FF35C2XN vs EP4SGX360FF35C4 Comparison
Detailed side-by-side comparison of EP4SGX360FF35C2XN by Intel and EP4SGX360FF35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
EP4SGX360FF35C2XN β ActiveSpecification Comparison
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FF35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,600.00 | $5,189.41 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| LABs/CLBs | 14,144 | β |
| Embedded Memory (bits) | 23,105,536 | β |
| Number of Logic Elements/Cells | 353,600 | β |
| Total RAM Bits | 23,105,536 | 23105536 |
| Number of I/O | 564 | 564 |
| User I/O Banks | 12 | β |
| Supply Voltage - Core | 0.9 V | β |
| Speed Grade | -2 | β |
| Number of Transceivers | 24 | 8 |
| Transceiver Data Rate (max) | 8.5 Gbps | β |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | β |
| Process Technology | 40 nm TSMC | 40 nm |
| Package | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (flip-chip) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| RoHS Status | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | Yes (per BGA finish) |
| Number of LABs/CLBs | β | 14144 |
| Core Voltage | β | 0.9 V |
| MSL Level | β | 3 (per JEDEC J-STD-020) |
| Supplier Device Package | β | 1152-FBGA |