EP4SGX360FF35C2XN vs EP4SGX360FF35C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35C2XN sa pamamagitan ng Intel at EP4SGX360FF35C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
EP4SGX360FF35C2XN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FF35C2XN | EP4SGX360FF35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | 23105536 |
| Number of I/O | 564 | 564 |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | 8 |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Packhaging | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (flip-chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | Yes (per BGA finish) |
| Number of LABs/CLBs | — | 14144 |
| Core Voltage | — | 0.9 V |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Supplier Device Package | — | 1152-FBGA |