EP4SGX360FF35I3 vs EP4SGX360FF35C2XN Comparison
Detailed side-by-side comparison of EP4SGX360FF35I3 by Intel and EP4SGX360FF35C2XN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35C2XN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Active |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 24 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | 8.5 Gbps |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Operating Temperature | -40C to +100C | 0C to +85C (Commercial) |
| Package | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | I3 | -2 |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Lead-Free | — | Yes |