EP4SGX360FF35I3 vs EP4SGX360FF35C2XN Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35I3 von Intel und EP4SGX360FF35C2XN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35C2XN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.695,00 | $2.600,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 24 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | 8.5 Gbps |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Betriebstemperatur | -40C to +100C | 0C to +85C (Commercial) |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 | -2 |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL-Level | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Lead-Free | — | Yes |