EP4SGX360FF35I3 vs EP4SGX360FF35C2XN Comparación
Comparación detallada lado a lado de EP4SGX360FF35I3 por Intel y EP4SGX360FF35C2XN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35I3 | EP4SGX360FF35C2XN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.695,00 | $2.600,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 24 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | 8.5 Gbps |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Temperatura de funcionamiento | -40C to +100C | 0C to +85C (Commercial) |
| Encapsulado | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | I3 | -2 |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Lead-Free | — | Yes |