EP4SGX360FF35I3 vs EP4SGX360FF35C2XN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35I3 sa pamamagitan ng Intel at EP4SGX360FF35C2XN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
EP4SGX360FF35C2XN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FF35I3 | EP4SGX360FF35C2XN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 24 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | 8.5 Gbps |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Temperature na Operasyon | -40C to +100C | 0C to +85C (Commercial) |
| Packhaging | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | I3 | -2 |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Lead-Free | — | Yes |