EP4SGX360FF35I3 vs EP4SGX360FF35C3 Comparison
Detailed side-by-side comparison of EP4SGX360FF35I3 by Intel and EP4SGX360FF35C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,695.00 | $2,285.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | β |
| Total RAM Bits | 23,105,536 | β |
| Embedded Memory | [DATA_NEEDED: total Kbits] | 23,105,536 bits |
| User I/O Count | 564 | β |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | β |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | β |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | β |
| Number of PLLs | [DATA_NEEDED: PLL count] | β |
| Core Voltage | 0.9 V | 0.9 V (0.87 V to 0.93 V) |
| Process Technology | 40 nm | 40 nm |
| Operating Temperature | -40C to +100C | β |
| Package | 1152-BBGA, FCBGA (Flip-Chip) | 1152-FBGA (35x35 mm), FCBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | I3 | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: MSL] | β |
| Logic Array Blocks (LAB) | β | 14,144 |
| User I/O Pins | β | 564 |
| Operating Junction Temperature | β | 0 C to 85 C |
| Grade | β | Commercial |
| Speed/Package Grade | β | FF35 |
| Memory Type | β | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | β | Yes (dedicated) |
| Hard Memory Controller | β | DDR/DDR2/DDR3, QDRII+, RLDRAM II |
| Lead-Free | β | Yes |