EP4SGX360FF35I3 vs EP4SGX360FF35C3 Comparación
Comparación detallada lado a lado de EP4SGX360FF35I3 por Intel y EP4SGX360FF35C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35I3 | EP4SGX360FF35C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.695,00 | $2.285,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | 23,105,536 bits |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | 0.9 V (0.87 V to 0.93 V) |
| Process Technology | 40 nm | 40 nm |
| Temperatura de funcionamiento | -40C to +100C | — |
| Encapsulado | 1152-BBGA, FCBGA (Flip-Chip) | 1152-FBGA (35x35 mm), FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL] | — |
| Logic Array Blocks (LAB) | — | 14,144 |
| User I/O Pins | — | 564 |
| Temperatura de unión de funcionamiento | — | 0 C to 85 C |
| Grade | — | Commercial |
| Speed/Package Grade | — | FF35 |
| Tipo de memoria | — | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | — | Yes (dedicated) |
| Hard Memory Controller | — | DDR/DDR2/DDR3, QDRII+, RLDRAM II |
| Lead-Free | — | Yes |