EP4SGX530HH35C2N vs EP4SGX530HH35C4 Comparison
Detailed side-by-side comparison of EP4SGX530HH35C2N by Intel and EP4SGX530HH35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35C2N | EP4SGX530HH35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,500.00 | $3,120.00 |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 531,200 | β |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory | 28,033,024 bits | β |
| Logic Cells / LABs | 21,248 LABs | β |
| User I/O Pins | 564 | β |
| Package | 1152-BBGA, FCBGA (FC-HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Package Size | 42.50 mm x 42.50 mm | β |
| Supply Voltage | 0.9 V (core) | β |
| Internal Frequency | 800 MHz (max) | β |
| Operating Temperature | 0C to +85C (commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Mounting Type | Surface Mount | Surface Mount (flip-chip BGA) |
| MSL Level | 3 | MSL3 (per BGA package standard) |
| RoHS Status | Compliant | Compliant |
| Transceiver Data Rate | up to 8.5 Gbps | β |
| PCIe Hard IP | Gen1 / Gen2 | β |
| Logic Elements | β | 531,200 |
| Embedded Memory (bits) | β | 28,033,024 |
| Maximum User I/O Pins | β | 564 |
| Process Technology | β | 40 nm |
| Core Supply Voltage | β | 0.9 V |
| Speed Grade | β | HH35 |
| Transceivers | β | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | β | [DATA_NEEDED: block count for this density] |
| PLLs | β | 8 fractional PLLs |