EP4SGX530HH35C2N vs EP4SGX530HH35C4 Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35C2N von Intel und EP4SGX530HH35C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35C2N | EP4SGX530HH35C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.500,00 | $3.120,00 |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory | 28,033,024 bits | — |
| Logic Cells / LABs | 21,248 LABs | — |
| User I/O Pins | 564 | — |
| Gehäuse | 1152-BBGA, FCBGA (FC-HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Package Size | 42.50 mm x 42.50 mm | — |
| Versorgungsspannung | 0.9 V (core) | — |
| Internal Frequency | 800 MHz (max) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Montageart | Surface Mount | Surface Mount (flip-chip BGA) |
| MSL-Level | 3 | MSL3 (per BGA package standard) |
| RoHS-Status | Compliant | Compliant |
| Transceiver Data Rate | up to 8.5 Gbps | — |
| PCIe Hard IP | Gen1 / Gen2 | — |
| Logic Elements | — | 531,200 |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | HH35 |
| Transceivers | — | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | — | [DATA_NEEDED: block count for this density] |
| PLLs | — | 8 fractional PLLs |