EP4SGX530HH35C2N vs EP4SGX530HH35C4 Comparación
Comparación detallada lado a lado de EP4SGX530HH35C2N por Intel y EP4SGX530HH35C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530HH35C2N | EP4SGX530HH35C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.500,00 | $3.120,00 |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory | 28,033,024 bits | — |
| Logic Cells / LABs | 21,248 LABs | — |
| User I/O Pins | 564 | — |
| Encapsulado | 1152-BBGA, FCBGA (FC-HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Package Size | 42.50 mm x 42.50 mm | — |
| Tensión de alimentación | 0.9 V (core) | — |
| Internal Frequency | 800 MHz (max) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Nivel MSL | 3 | MSL3 (per BGA package standard) |
| Estado RoHS | Compliant | Compliant |
| Transceiver Data Rate | up to 8.5 Gbps | — |
| PCIe Hard IP | Gen1 / Gen2 | — |
| Logic Elements | — | 531,200 |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | HH35 |
| Transceivers | — | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | — | [DATA_NEEDED: block count for this density] |
| PLLs | — | 8 fractional PLLs |