EP4SGX530HH35C4 vs EP4SGX530HH35C2N Comparison
Detailed side-by-side comparison of EP4SGX530HH35C4 by Intel and EP4SGX530HH35C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35C4 | EP4SGX530HH35C2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,120.00 | $3,500.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | β |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | β |
| Maximum User I/O Pins | 564 | β |
| Process Technology | 40 nm | β |
| Core Supply Voltage | 0.9 V | β |
| Package | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA, FCBGA (FC-HFBGA) |
| Speed Grade | HH35 | β |
| Operating Temperature | 0 C to 85 C (Commercial, -C4 suffix) | 0C to +85C (commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | β |
| DSP Blocks | [DATA_NEEDED: block count for this density] | β |
| PLLs | 8 fractional PLLs | β |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL Level | MSL3 (per BGA package standard) | 3 |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | β | 531,200 |
| Embedded Memory | β | 28,033,024 bits |
| Logic Cells / LABs | β | 21,248 LABs |
| User I/O Pins | β | 564 |
| Package Size | β | 42.50 mm x 42.50 mm |
| Supply Voltage | β | 0.9 V (core) |
| Internal Frequency | β | 800 MHz (max) |
| Transceiver Data Rate | β | up to 8.5 Gbps |
| PCIe Hard IP | β | Gen1 / Gen2 |