EP4SGX530HH35C4 vs EP4SGX530HH35C2N Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35C4 von Intel und EP4SGX530HH35C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35C4 | EP4SGX530HH35C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.120,00 | $3.500,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | — |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Gehäuse | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA, FCBGA (FC-HFBGA) |
| Speed Grade | HH35 | — |
| Betriebstemperatur | 0 C to 85 C (Commercial, -C4 suffix) | 0C to +85C (commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | — |
| DSP Blocks | [DATA_NEEDED: block count for this density] | — |
| PLLs | 8 fractional PLLs | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL-Level | MSL3 (per BGA package standard) | 3 |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 531,200 |
| Embedded Memory | — | 28,033,024 bits |
| Logic Cells / LABs | — | 21,248 LABs |
| User I/O Pins | — | 564 |
| Package Size | — | 42.50 mm x 42.50 mm |
| Versorgungsspannung | — | 0.9 V (core) |
| Internal Frequency | — | 800 MHz (max) |
| Transceiver Data Rate | — | up to 8.5 Gbps |
| PCIe Hard IP | — | Gen1 / Gen2 |