EP4SGX530HH35C4 vs EP4SGX530HH35C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX530HH35C4 sa pamamagitan ng Intel at EP4SGX530HH35C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX530HH35C4 | EP4SGX530HH35C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | — |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Packhaging | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA, FCBGA (FC-HFBGA) |
| Speed Grade | HH35 | — |
| Temperature na Operasyon | 0 C to 85 C (Commercial, -C4 suffix) | 0C to +85C (commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | — |
| DSP Blocks | [DATA_NEEDED: block count for this density] | — |
| PLLs | 8 fractional PLLs | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Level ng MSL | MSL3 (per BGA package standard) | 3 |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 531,200 |
| Embedded Memory | — | 28,033,024 bits |
| Logic Cells / LABs | — | 21,248 LABs |
| User I/O Pins | — | 564 |
| Package Size | — | 42.50 mm x 42.50 mm |
| Volte ng Pagbibigay | — | 0.9 V (core) |
| Internal Frequency | — | 800 MHz (max) |
| Transceiver Data Rate | — | up to 8.5 Gbps |
| PCIe Hard IP | — | Gen1 / Gen2 |