EPF10K100ARC240-3N vs EPF10K100BFC256-3 Comparison
Detailed side-by-side comparison of EPF10K100ARC240-3N by Intel and EPF10K100BFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100ARC240-3N | EPF10K100BFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $18.40 | $58.20 |
| Family | FLEX 10KA | FLEX 10KE |
| Series | FLEX 10K | β |
| System Gates | 100,000 | β |
| Logic Elements (LE) | 4,992 | β |
| Logic Array Blocks (LAB) | 624 | β |
| Embedded Array Blocks (EAB) | 12 | β |
| On-chip RAM | 24,576 bits (24.18 kbit) | β |
| User I/Os | 189 | β |
| Process Technology | 0.3 Β΅m CMOS | 0.22 Β΅m CMOS SRAM |
| Core Supply Voltage | 3.3 V | 2.5 V (range 2.3 V to 2.7 V) |
| Speed Grade | -3 | -3 |
| Propagation Delay | 0.6000 ns | β |
| Package | 240-RQFP (BFQFP with exposed pad) | 256-pin FineLine BGA (FBGA) |
| Operating Temperature | 0 Β°C to 70 Β°C (commercial) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration | JTAG / passive serial / passive parallel / active serial | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Typical Gates | β | 100,000 |
| Logic Elements (LEs) | β | 4,992 |
| Embedded Array Blocks (EABs) | β | 12 |
| Total RAM Bits | β | 24,576 |
| Maximum Operating Frequency | β | 200 MHz |
| User I/O Pins (max) | β | [DATA_NEEDED: exact user I/O count for BFC256 package] |
| Operating Temperature Range | β | 0 Β°C to 70 Β°C |
| Configuration Method | β | SRAM, requires external config device |
| JTAG Boundary Scan | β | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | β | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| MSL Level | β | [DATA_NEEDED: MSL rating] |