EPF10K100ARC240-3N vs EPF10K100BFC256-3 Comparison
Detailed side-by-side comparison of EPF10K100ARC240-3N by Intel and EPF10K100BFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100ARC240-3N | EPF10K100BFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10KA | FLEX 10KE |
| Series | FLEX 10K | — |
| System Gates | 100,000 | — |
| Logic Elements (LE) | 4,992 | — |
| Logic Array Blocks (LAB) | 624 | — |
| Embedded Array Blocks (EAB) | 12 | — |
| On-chip RAM | 24,576 bits (24.18 kbit) | — |
| User I/Os | 189 | — |
| Process Technology | 0.3 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 2.5 V (range 2.3 V to 2.7 V) |
| Speed Grade | -3 | -3 |
| Propagation Delay | 0.6000 ns | — |
| Package | 240-RQFP (BFQFP with exposed pad) | 256-pin FineLine BGA (FBGA) |
| Operating Temperature | 0 °C to 70 °C (commercial) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration | JTAG / passive serial / passive parallel / active serial | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 100,000 |
| Logic Elements (LEs) | — | 4,992 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 |
| Maximum Operating Frequency | — | 200 MHz |
| User I/O Pins (max) | — | [DATA_NEEDED: exact user I/O count for BFC256 package] |
| Operating Temperature Range | — | 0 °C to 70 °C |
| Configuration Method | — | SRAM, requires external config device |
| JTAG Boundary Scan | — | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | — | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| MSL Level | — | [DATA_NEEDED: MSL rating] |