EPF10K100ARC240-3N vs EPF10K100BFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100ARC240-3N sa pamamagitan ng Intel at EPF10K100BFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K100ARC240-3N | EPF10K100BFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 10KA | FLEX 10KE |
| Series | FLEX 10K | — |
| System Gates | 100,000 | — |
| Logic Elements (LE) | 4,992 | — |
| Logic Array Blocks (LAB) | 624 | — |
| Embedded Array Blocks (EAB) | 12 | — |
| On-chip RAM | 24,576 bits (24.18 kbit) | — |
| User I/Os | 189 | — |
| Process Technology | 0.3 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 2.5 V (range 2.3 V to 2.7 V) |
| Speed Grade | -3 | -3 |
| Propagation Delay | 0.6000 ns | — |
| Packhaging | 240-RQFP (BFQFP with exposed pad) | 256-pin FineLine BGA (FBGA) |
| Temperature na Operasyon | 0 °C to 70 °C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration | JTAG / passive serial / passive parallel / active serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 100,000 |
| Logic Elements (LEs) | — | 4,992 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 |
| Maximum Operating Frequency | — | 200 MHz |
| User I/O Pins (max) | — | [DATA_NEEDED: exact user I/O count for BFC256 package] |
| Hanay ng Temperature na Operasyon | — | 0 °C to 70 °C |
| Configuration Method | — | SRAM, requires external config device |
| JTAG Boundary Scan | — | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | — | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |