EPF10K100ARC240-3N vs EPF10K100BFC256-3 对比
详细并排对比 EPF10K100ARC240-3N 出自 Intel 和 EPF10K100BFC256-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K100ARC240-3N | EPF10K100BFC256-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $18.40 | $58.20 |
| Family | FLEX 10KA | FLEX 10KE |
| Series | FLEX 10K | — |
| System Gates | 100,000 | — |
| Logic Elements (LE) | 4,992 | — |
| Logic Array Blocks (LAB) | 624 | — |
| Embedded Array Blocks (EAB) | 12 | — |
| On-chip RAM | 24,576 bits (24.18 kbit) | — |
| User I/Os | 189 | — |
| Process Technology | 0.3 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 2.5 V (range 2.3 V to 2.7 V) |
| Speed Grade | -3 | -3 |
| Propagation Delay | 0.6000 ns | — |
| 封装 | 240-RQFP (BFQFP with exposed pad) | 256-pin FineLine BGA (FBGA) |
| 工作温度 | 0 °C to 70 °C (commercial) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration | JTAG / passive serial / passive parallel / active serial | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 100,000 |
| Logic Elements (LEs) | — | 4,992 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 |
| Maximum Operating Frequency | — | 200 MHz |
| User I/O Pins (max) | — | [DATA_NEEDED: exact user I/O count for BFC256 package] |
| 工作温度范围 | — | 0 °C to 70 °C |
| Configuration Method | — | SRAM, requires external config device |
| JTAG Boundary Scan | — | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | — | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |