EPF10K100EFC484-3N vs EPF10K130EFC484-3 Comparison
Detailed side-by-side comparison of EPF10K100EFC484-3N by Intel and EPF10K130EFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100EFC484-3N | EPF10K130EFC484-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $142.00 | $178.92 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 4992 | β |
| Total Gates | 100,000 | β |
| Embedded Memory (EAB) | 49,152 bits (12 EABs) | β |
| Logic Array Blocks (LABs) | 624 | 832 |
| User I/Os | 338 | β |
| Process Technology | 0.22 Β΅m CMOS | β |
| Core Voltage (VCCINT) | 2.5 V | β |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) | β |
| Internal Performance | 200 MHz | β |
| Speed Grade | -3 (fastest commercial bin) | -3 |
| Package | 484-ball FineLine BGA (FC484 / FBGA-484) | 484-pin FBGA (FineLine BGA) |
| Temperature Grade | Commercial (0 Β°C to +70 Β°C) | β |
| Configuration Method | SRAM (external EPROM/Flash/JTAG required at power-up) | SRAM-based, serial or parallel, requires external configuration device |
| Lead-Free / RoHS | Yes (N suffix = lead-free) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LEs) | β | 6,656 |
| Typical Gate Count | β | 130,000 system gates |
| Embedded Memory (EABs) | β | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | β | 369 |
| Supply Voltage (Core) | β | 3.3 V |
| I/O Voltage Support | β | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Propagation Delay | β | 0.6 ns (per LE) |
| Operating Temperature | β | 0 C to +70 C (commercial) |
| RoHS Status | β | [DATA_NEEDED: RoHS status] |
| Logic Family | β | CMOS (SRAM-based) |