EPF10K130EFI484-2 vs EPF10K130EFC484-3N Comparison
Detailed side-by-side comparison of EPF10K130EFI484-2 by Intel and EPF10K130EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFI484-2 | EPF10K130EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $92.00 | $109.25 |
| Family | FLEX 10KE | β |
| Logic Elements / Cells | 6,656 | β |
| Equivalent Gate Count | 130,000 gates | β |
| Total RAM Bits | 65,536 bits | 65536 |
| User I/Os | 274 | β |
| Number of Logic Array Blocks | 1,664 LABs | β |
| Number of Embedded Array Blocks | [DATA_NEEDED: EAB count] | β |
| Internal Clock Frequency | 333.33 MHz | β |
| Propagation Delay | 0.6 ns | β |
| Core Supply Voltage | 2.5 V | β |
| I/O Supply Voltage | 3.3 V (PCI-compliant) | β |
| Process Technology | 0.22 Β΅m CMOS | 0.22 Β΅m CMOS |
| Operating Temperature | 0 Β°C to 70 Β°C (commercial) | β |
| Package | 484-ball FineLine BGA (FBGA-484) | β |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | β | FLEX-10KE |
| Number of Logic Elements / Cells | β | 6656 |
| Typical Gate Count | β | 130000 |
| Number of I/O | β | 369 |
| Number of LABs/CLBs | β | 832 |
| Number of Embedded Array Blocks (EABs) | β | 72 |
| Speed Grade | β | -3 (faster timing bin) |
| Operating Temperature Grade | β | Commercial (0C to +70C) |
| Core Voltage | β | 2.5 V |
| Package Type | β | 484-BBGA (FineLine BGA) |
| Package Dimensions | β | 23 x 23 mm |
| Ball Pitch | β | 1.0 mm |
| Configuration Memory | β | SRAM-based (volatile, requires config device) |
| Configuration Interface | β | JTAG / PS / PPS / Altera serial |