EPF10K130EFI484-2 vs EPF10K130EFC484-3N Vergleich
Detaillierter Direktvergleich von EPF10K130EFI484-2 von Intel und EPF10K130EFC484-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K130EFI484-2 | EPF10K130EFC484-3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $109,25 |
| Family | FLEX 10KE | — |
| Logic Elements / Cells | 6,656 | — |
| Equivalent Gate Count | 130,000 gates | — |
| Total RAM Bits | 65,536 bits | 65536 |
| User I/Os | 274 | — |
| Number of Logic Array Blocks | 1,664 LABs | — |
| Number of Embedded Array Blocks | [DATA_NEEDED: EAB count] | — |
| Internal Clock Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (PCI-compliant) | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Betriebstemperatur | 0 °C to 70 °C (commercial) | — |
| Gehäuse | 484-ball FineLine BGA (FBGA-484) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Speed Grade | — | -3 (faster timing bin) |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |