EPF10K200EBC600-1 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $322.17 $880.00
Product Type Field Programmable Gate Array (FPGA) β€”
Device Family FLEX-10KE β€”
Logic Elements 9,984 β€”
Embedded Memory 98,304 bits β€”
Logic Array Blocks 1,248 LABs β€”
I/O Count 470 I/O β€”
Supply Voltage 2.5 V β€”
Package 600-BGA β€”
Technology Mixed CMOS β€”
Commercial Temperature 85 C β€”
Propagation Delay 0.4 ns β€”
Embedded Array Enhanced embedded array β€”
Memory Feature Dual-port memory β€”
RoHS Status unknown [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Configuration Interface [DATA_NEEDED: configuration interface] β€”
Package Dimensions [DATA_NEEDED: package dimensions] 62.48 x 62.48 mm
Operating Current [DATA_NEEDED: operating current] β€”
Pinout [DATA_NEEDED: 600-BGA ball map] β€”
Moisture Sensitivity Level [DATA_NEEDED: MSL level] β€”
Family β€” FLEX 10KE
Logic Elements (LEs) β€” 9,984
Typical Gates β€” 200,000
Embedded Array Blocks (EABs) β€” 470
Total RAM Bits β€” 98,304
Core Supply Voltage β€” 2.375 V to 2.625 V
I/O Voltage Tolerance β€” 5.0 V tolerant
Pin Count β€” 599
Package Type β€” 599-BCPGA (Ceramic Pin Grid Array)
Mounting Type β€” Through-Hole (Socket or Solder)
Operating Temperature β€” 0C to +70C (Commercial)
Programming Interface β€” JTAG (IEEE 1149.1)
PLLs β€” 4

Datasheets & Resources

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