EPF10K200EBC600-1 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Supply Voltage 2.5 V —
Package 600-BGA —
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns —
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
RoHS Status unknown [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] 62.48 x 62.48 mm
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — FLEX 10KE
Logic Elements (LEs) — 9,984
Typical Gates — 200,000
Embedded Array Blocks (EABs) — 470
Total RAM Bits — 98,304
Core Supply Voltage — 2.375 V to 2.625 V
I/O Voltage Tolerance — 5.0 V tolerant
Pin Count — 599
Package Type — 599-BCPGA (Ceramic Pin Grid Array)
Mounting Type — Through-Hole (Socket or Solder)
Operating Temperature — 0C to +70C (Commercial)
Programming Interface — JTAG (IEEE 1149.1)
PLLs — 4

Datasheets & Resources

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