EPF10K200EBC600-1 vs EPF10K200EGC599-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-1 sa pamamagitan ng Intel at EPF10K200EGC599-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-1 | EPF10K200EGC599-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | FLEX-10KE | — |
| Logic Elements | 9,984 | — |
| Embedded Memory | 98,304 bits | — |
| Logic Array Blocks | 1,248 LABs | — |
| I/O Count | 470 I/O | — |
| Volte ng Pagbibigay | 2.5 V | — |
| Packhaging | 600-BGA | — |
| Technology | Mixed CMOS | — |
| Commercial Temperature | 85 C | — |
| Propagation Delay | 0.4 ns | — |
| Embedded Array | Enhanced embedded array | — |
| Memory Feature | Dual-port memory | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 62.48 x 62.48 mm |
| Operating Current | [DATA_NEEDED: operating current] | — |
| Pinout | [DATA_NEEDED: 600-BGA ball map] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Array Blocks (EABs) | — | 470 |
| Total RAM Bits | — | 98,304 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Bilang ng Pin | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Uri ng Pagpapasok | — | Through-Hole (Socket or Solder) |
| Temperature na Operasyon | — | 0C to +70C (Commercial) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |