EPF10K200EBC600-1 vs EPF10K200EGC599-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EBC600-1 disebabkan oleh Intel dan EPF10K200EGC599-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPF10K200EBC600-1 | EPF10K200EGC599-1 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | FLEX-10KE | — |
| Logic Elements | 9,984 | — |
| Embedded Memory | 98,304 bits | — |
| Logic Array Blocks | 1,248 LABs | — |
| I/O Count | 470 I/O | — |
| Tegangan Pemberi Arus | 2.5 V | — |
| Kemasan | 600-BGA | — |
| Technology | Mixed CMOS | — |
| Commercial Temperature | 85 C | — |
| Propagation Delay | 0.4 ns | — |
| Embedded Array | Enhanced embedded array | — |
| Memory Feature | Dual-port memory | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 62.48 x 62.48 mm |
| Operating Current | [DATA_NEEDED: operating current] | — |
| Pinout | [DATA_NEEDED: 600-BGA ball map] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Array Blocks (EABs) | — | 470 |
| Total RAM Bits | — | 98,304 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Kiraan Pin | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Jenis Pemasangan | — | Through-Hole (Socket or Solder) |
| Suhu Operasi | — | 0C to +70C (Commercial) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |