EPF10K200EBC600-2 vs EPF10K200SBC600-1 比較
詳細並排比較 EPF10K200EBC600-2 由 Intel 與 EPF10K200SBC600-1 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 Obsolete規格比較
| 參數 | EPF10K200EBC600-2 | EPF10K200SBC600-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX-10KE | EPF10K200 |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 µm CMOS |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| 供應電壓 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作溫度 | 0°C to +70°C (Commercial) | 0 °C to 70 °C (Commercial) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 狀態 | unknown | Non-compliant (per third-party listing) |
| Family | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Gate Count (typical) | — | 200,000 gates |
| Number of User I/Os | — | 470 |
| Number of Logic Cells | — | 4,992 |
| Embedded RAM (bits) | — | 24,576 (across EABs) |
| Max Internal Frequency | — | 250 MHz |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (typ. 2.5 V) |
| Speed Grade | — | -1 (fastest commercial) |
| 封裝 | — | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| JTAG Support | — | IEEE Std 1149.1 |
| Configuration | — | Serial via EPC2/EPC8 configuration devices |