EPF10K200EBC600-2 vs EPF10K200SBC600-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-2 sa pamamagitan ng Intel at EPF10K200SBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-2 | EPF10K200SBC600-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX-10KE | EPF10K200 |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 µm CMOS |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Volte ng Pagbibigay | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| Temperature na Operasyon | 0°C to +70°C (Commercial) | 0 °C to 70 °C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| Tindminan RoHS | unknown | Non-compliant (per third-party listing) |
| Family | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Gate Count (typical) | — | 200,000 gates |
| Number of User I/Os | — | 470 |
| Number of Logic Cells | — | 4,992 |
| Embedded RAM (bits) | — | 24,576 (across EABs) |
| Max Internal Frequency | — | 250 MHz |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (typ. 2.5 V) |
| Speed Grade | — | -1 (fastest commercial) |
| Packhaging | — | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| JTAG Support | — | IEEE Std 1149.1 |
| Configuration | — | Serial via EPC2/EPC8 configuration devices |