EPF10K200EBC600-3 vs EPF10K250EBC600-3 Comparison
Detailed side-by-side comparison of EPF10K200EBC600-3 by Intel and EPF10K250EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteSpecification Comparison
| Parameter | EPF10K200EBC600-3 | EPF10K250EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | 470 |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | SRAM-based CMOS |
| Speed Grade | -3 (commercial) | -3 |
| Package | 600-ball FineLine BGA, 45 x 45 mm | 600-ball FineLine BGA |
| Mounting Type | Surface Mount | — |
| Operating Temperature | 0C to +70C (commercial) | [DATA_NEEDED: operating temperature range] |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | — |
| Logic Elements | — | 12,160 LEs |
| Typical Gates | — | 250,000 |
| Embedded Array Blocks (EABs) | — | 12 (each 2 Kbits) |
| Total Embedded Memory | — | 24 Kbits (RAM) |
| PLLs (Phase-Locked Loops) | — | 4 |
| Dedicated Clock Inputs | — | 6 |
| Core Supply Voltage | — | 3.3 V |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant) |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |