EPF10K200EFC672-2 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-2 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Last Time Buy
Family FLEX 10KE FLEX 10KE
Logic Elements 9,984 —
Typical Gates 200,000 200,000
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 470
Logic Array Blocks (LABs) 624 —
Package 672-BBGA (FineLine BGA) —
Package Dimensions 45 x 45 mm 62.48 x 62.48 mm
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS —
Speed Grade -2 —
Propagation Delay 0.4 ns —
Operating Temperature 0 C to 70 C 0C to +70C (Commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
RoHS Status Compliant (per distributor listing) [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Logic Family CMOS —
Logic Elements (LEs) — 9,984
Total RAM Bits — 98,304
Core Supply Voltage — 2.375 V to 2.625 V
I/O Voltage Tolerance — 5.0 V tolerant
Pin Count — 599
Package Type — 599-BCPGA (Ceramic Pin Grid Array)
Mounting Type — Through-Hole (Socket or Solder)
Programming Interface — JTAG (IEEE 1149.1)
PLLs — 4

Datasheets & Resources

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