EPF10K200EFC672-2 vs EPF10K200EGC599-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-2 sa pamamagitan ng Intel at EPF10K200EGC599-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EFC672-2 EPF10K200EGC599-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family FLEX 10KE FLEX 10KE
Logic Elements 9,984 —
Typical Gates 200,000 200,000
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 470
Logic Array Blocks (LABs) 624 —
Packhaging 672-BBGA (FineLine BGA) —
Package Dimensions 45 x 45 mm 62.48 x 62.48 mm
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS —
Speed Grade -2 —
Propagation Delay 0.4 ns —
Temperature na Operasyon 0 C to 70 C 0C to +70C (Commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
Tindminan RoHS Compliant (per distributor listing) [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Logic Family CMOS —
Logic Elements (LEs) — 9,984
Total RAM Bits — 98,304
Core Supply Voltage — 2.375 V to 2.625 V
I/O Voltage Tolerance — 5.0 V tolerant
Bilang ng Pin — 599
Package Type — 599-BCPGA (Ceramic Pin Grid Array)
Uri ng Pagpapasok — Through-Hole (Socket or Solder)
Programming Interface — JTAG (IEEE 1149.1)
PLLs — 4

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita