EPF10K200EFC672-2 vs EPF10K200SFC672-1X Comparison

Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K200SFC672-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-2 EPF10K200SFC672-1X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 10KE FLEX 10K (legacy)
Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 24
Logic Array Blocks (LABs) 624 1,248
Package 672-BBGA (FineLine BGA) 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch
Package Dimensions 45 x 45 mm —
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS —
Speed Grade -2 —
Propagation Delay 0.4 ns 0.4 ns
Operating Temperature 0 C to 70 C 0 °C to 70 °C (Commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
RoHS Status Compliant (per distributor listing) [DATA_NEEDED: RoHS compliance status]
Logic Family CMOS CMOS
Series — FLEX-10KS
Architecture — Reconfigurable CMOS SRAM
Typical System Gates — 200,000
Maximum System Gates — [DATA_NEEDED: maximum system gate count]
Logic Elements (LEs) — 9,984
Embedded RAM Bits — 98,304
User I/O Pins — 470
Core Supply Voltage — 2.375 V to 2.625 V (2.5 V nominal)
JTAG Support — IEEE Std. 1149.1 (adds up to 31,250 gates)
Mounting Type — Surface Mount
Configuration Method — SRAM (volatile, reconfigurable at every power-up)
Design Tool — Quartus (legacy FLEX 10K support)

Datasheets & Resources

Browse All Products Create BOM Request Quote