EPF10K200EFC672-2 vs EPF10K200SFC672-1X Vergleich
Detaillierter Direktvergleich von EPF10K200EFC672-2 von Intel und EPF10K200SFC672-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200EFC672-2 | EPF10K200SFC672-1X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $210,00 | $135,00 |
| Family | FLEX 10KE | FLEX 10K (legacy) |
| Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum User I/Os | 470 | — |
| Embedded Memory | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 | 24 |
| Logic Array Blocks (LABs) | 624 | 1,248 |
| Gehäuse | 672-BBGA (FineLine BGA) | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch |
| Package Dimensions | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Process Technology | 0.22 um CMOS | — |
| Speed Grade | -2 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Betriebstemperatur | 0 C to 70 C | 0 °C to 70 °C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Programmability | JTAG (IEEE 1149.1) / in-system | — |
| RoHS-Status | Compliant (per distributor listing) | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | CMOS | CMOS |
| Series | — | FLEX-10KS |
| Architecture | — | Reconfigurable CMOS SRAM |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | [DATA_NEEDED: maximum system gate count] |
| Logic Elements (LEs) | — | 9,984 |
| Embedded RAM Bits | — | 98,304 |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.375 V to 2.625 V (2.5 V nominal) |
| JTAG Support | — | IEEE Std. 1149.1 (adds up to 31,250 gates) |
| Montageart | — | Surface Mount |
| Configuration Method | — | SRAM (volatile, reconfigurable at every power-up) |
| Design Tool | — | Quartus (legacy FLEX 10K support) |