EPF10K200EGC599-1 vs EPF10K200EFC672-2 Comparison
Detailed side-by-side comparison of EPF10K200EGC599-1 by Intel and EPF10K200EFC672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Last Time Buy
Specification Comparison
| Parameter | EPF10K200EGC599-1 | EPF10K200EFC672-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | 200,000 |
| Embedded Array Blocks (EABs) | 470 | 12 |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Pin Count | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | 45 x 45 mm |
| Mounting Type | Through-Hole (Socket or Solder) | — |
| Operating Temperature | 0C to +70C (Commercial) | 0 C to 70 C |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| RoHS Status | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | Compliant (per distributor listing) |
| Logic Elements | — | 9,984 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks (LABs) | — | 624 |
| Package | — | 672-BBGA (FineLine BGA) |
| Ball Pitch | — | 1.27 mm |
| Process Technology | — | 0.22 um CMOS |
| Speed Grade | — | -2 |
| Propagation Delay | — | 0.4 ns |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |
| Logic Family | — | CMOS |