EPF10K200EGC599-1 vs EPF10K200EFC672-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EGC599-1 disebabkan oleh Intel dan EPF10K200EFC672-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EPF10K200EGC599-1 | EPF10K200EFC672-2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | 200,000 |
| Embedded Array Blocks (EABs) | 470 | 12 |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Kiraan Pin | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | 45 x 45 mm |
| Jenis Pemasangan | Through-Hole (Socket or Solder) | — |
| Suhu Operasi | 0C to +70C (Commercial) | 0 C to 70 C |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| Status RoHS | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | Compliant (per distributor listing) |
| Logic Elements | — | 9,984 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks (LABs) | — | 624 |
| Kemasan | — | 672-BBGA (FineLine BGA) |
| Ball Pitch | — | 1.27 mm |
| Process Technology | — | 0.22 um CMOS |
| Speed Grade | — | -2 |
| Propagation Delay | — | 0.4 ns |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |
| Logic Family | — | CMOS |