EPF10K200SBC356-1 vs EPF10K200SBC356-2X Comparison

Detailed side-by-side comparison of EPF10K200SBC356-1 by Intel and EPF10K200SBC356-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC356-1 EPF10K200SBC356-2X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Family FLEX 10K (Classic embedded array) FLEX 10K
Logic Elements / Cells 9,984 9984
Number of LABs / CLBs 1,248 —
Total RAM Bits 98,304 —
Equivalent Gate Count 200,000 (system gates ~513,000) —
Number of User I/Os 274 —
Propagation Delay 0.4 ns (-1 speed grade) —
Core Supply Voltage 2.375 V to 2.625 V —
Operating Temperature 0 °C to 70 °C (commercial) 0 °C to +70 °C (commercial)
Package 356-LBGA (35 x 35 mm, 1.27 mm pitch) 356-LBGA (35x35 mm, 1.27 mm pitch)
Mounting Type Surface Mount Surface Mount
Logic Family / Process CMOS SRAM LUT —
Configuration Method SRAM (volatile) - requires configuration device or JTAG SRAM-based, requires external configuration device (EPC2/EPC8)
RoHS Status [DATA_NEEDED: RoHS status] —
MSL Level [DATA_NEEDED: MSL level] —
Series — FLEX-10KS
Approximate Gate Count — 200,000
Logic Array Blocks (LABs) — 1248
User I/O Count — 274
Supply Voltage — 2.375 V to 2.625 V (core)
Process Technology — CMOS 0.22 µm
Propagation Delay (typ.) — 0.4 ns
Speed Grade — -2
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
In-System Programmability — Yes (via JTAG or serial interface)

Datasheets & Resources

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