EPF10K200SBC356-1 vs EPF10K200SBC356-2X 비교
다음의 상세 나란히 비교: EPF10K200SBC356-1 제조: Intel 및 EPF10K200SBC356-2X 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 NrndIntel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X Nrnd사양 비교
| 파라미터 | EPF10K200SBC356-1 | EPF10K200SBC356-2X |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $580.00 | $295.00 |
| Family | FLEX 10K (Classic embedded array) | FLEX 10K |
| Logic Elements / Cells | 9,984 | 9984 |
| Number of LABs / CLBs | 1,248 | — |
| Total RAM Bits | 98,304 | — |
| Equivalent Gate Count | 200,000 (system gates ~513,000) | — |
| Number of User I/Os | 274 | — |
| Propagation Delay | 0.4 ns (-1 speed grade) | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| 동작 온도 | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| 패키지 | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 실장 유형 | Surface Mount | Surface Mount |
| Logic Family / Process | CMOS SRAM LUT | — |
| Configuration Method | SRAM (volatile) - requires configuration device or JTAG | SRAM-based, requires external configuration device (EPC2/EPC8) |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | — |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KS |
| Approximate Gate Count | — | 200,000 |
| Logic Array Blocks (LABs) | — | 1248 |
| User I/O Count | — | 274 |
| 공급 전압 | — | 2.375 V to 2.625 V (core) |
| Process Technology | — | CMOS 0.22 µm |
| Propagation Delay (typ.) | — | 0.4 ns |
| Speed Grade | — | -2 |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |