EPF10K200SBC356-1 vs EPF10K200SBC356-2X Perbandingan
Perbandingan bersamaan detil EPF10K200SBC356-1 dari Intel dan EPF10K200SBC356-2X dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 NrndIntel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X NrndPerbandingan Spesifikasi
| Parameter Umum | EPF10K200SBC356-1 | EPF10K200SBC356-2X |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | FLEX 10K (Classic embedded array) | FLEX 10K |
| Logic Elements / Cells | 9,984 | 9984 |
| Number of LABs / CLBs | 1,248 | — |
| Total RAM Bits | 98,304 | — |
| Equivalent Gate Count | 200,000 (system gates ~513,000) | — |
| Number of User I/Os | 274 | — |
| Propagation Delay | 0.4 ns (-1 speed grade) | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Suhu Kerja | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Paket | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Logic Family / Process | CMOS SRAM LUT | — |
| Configuration Method | SRAM (volatile) - requires configuration device or JTAG | SRAM-based, requires external configuration device (EPC2/EPC8) |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KS |
| Approximate Gate Count | — | 200,000 |
| Logic Array Blocks (LABs) | — | 1248 |
| User I/O Count | — | 274 |
| Tegangan Pemuat | — | 2.375 V to 2.625 V (core) |
| Process Technology | — | CMOS 0.22 µm |
| Propagation Delay (typ.) | — | 0.4 ns |
| Speed Grade | — | -2 |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |