EPF10K200SBC356-3 vs EPF10K200SBC356-1 Comparison

Detailed side-by-side comparison of EPF10K200SBC356-3 by Intel and EPF10K200SBC356-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC356-3 EPF10K200SBC356-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Family FLEX 10K FLEX 10K (Classic embedded array)
Device Type FPGA - Field Programmable Gate Array —
Typical Gates 200,000 —
Logic Elements (Cells) 9,984 —
Logic Array Blocks (LABs) 1,248 —
Embedded Array Blocks (EABs) 12 —
Total EAB RAM 98,304 bits —
User I/Os 470 (package exposes 274 bonded-out) —
Flip-Flops 4,992 —
Process Technology 0.22 um CMOS, 4 metal layers —
Core Supply Voltage 2.375 V to 2.625 V 2.375 V to 2.625 V
Propagation Delay 0.4 ns 0.4 ns (-1 speed grade)
Internal Performance (fmax) 250 MHz —
Operating Temperature 0 C to 70 C (Commercial) 0 °C to 70 °C (commercial)
Package PBGA-356 (35 x 35 mm, 1.27 mm pitch) 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Mounting Type Surface Mount Surface Mount
Configuration Mode Passive Serial / Passive Parallel / JTAG —
MultiVolt I/O 2.5 V / 3.3 V / 5.0 V —
Logic Family CMOS —
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1,248
Total RAM Bits — 98,304
Equivalent Gate Count — 200,000 (system gates ~513,000)
Number of User I/Os — 274
Logic Family / Process — CMOS SRAM LUT
Configuration Method — SRAM (volatile) - requires configuration device or JTAG
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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