EPF10K200SBC356-3 vs EPF10K200SBC356-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-3 sa pamamagitan ng Intel at EPF10K200SBC356-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SBC356-3 EPF10K200SBC356-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 10K FLEX 10K (Classic embedded array)
Device Type FPGA - Field Programmable Gate Array —
Typical Gates 200,000 —
Logic Elements (Cells) 9,984 —
Logic Array Blocks (LABs) 1,248 —
Embedded Array Blocks (EABs) 12 —
Total EAB RAM 98,304 bits —
User I/Os 470 (package exposes 274 bonded-out) —
Flip-Flops 4,992 —
Process Technology 0.22 um CMOS, 4 metal layers —
Core Supply Voltage 2.375 V to 2.625 V 2.375 V to 2.625 V
Propagation Delay 0.4 ns 0.4 ns (-1 speed grade)
Internal Performance (fmax) 250 MHz —
Temperature na Operasyon 0 C to 70 C (Commercial) 0 °C to 70 °C (commercial)
Packhaging PBGA-356 (35 x 35 mm, 1.27 mm pitch) 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Mode Passive Serial / Passive Parallel / JTAG —
MultiVolt I/O 2.5 V / 3.3 V / 5.0 V —
Logic Family CMOS —
Tindminan RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1,248
Total RAM Bits — 98,304
Equivalent Gate Count — 200,000 (system gates ~513,000)
Number of User I/Os — 274
Logic Family / Process — CMOS SRAM LUT
Configuration Method — SRAM (volatile) - requires configuration device or JTAG
Level ng MSL — [DATA_NEEDED: MSL level]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita