EPF10K200SFC484-2X vs EPF10K200SFC484-3 Comparison

Detailed side-by-side comparison of EPF10K200SFC484-2X by Intel and EPF10K200SFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-2X EPF10K200SFC484-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Series FLEX 10KS FLEX-10KS
Family FLEX 10K FLEX 10K
Number of Logic Elements / Cells 9984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98304 —
Number of Gates 200000 (typical) —
Number of I/O 369 —
Core Voltage - Supply 2.375 V to 2.625 V —
Operating Frequency (max) 250 MHz (family-typical, -2 speed grade) —
Operating Temperature 0C to +70C (commercial) 0 °C to +70 °C (Commercial)
Package / Case 484-BBGA (FineLine BGA) —
Supplier Device Package 484-FBGA (23 x 23 mm, 1.0 mm pitch) —
Mounting Type Surface Mount Surface Mount
Technology CMOS, SRAM-based configuration —
Configuration Memory External serial (EPC1/EPC2 family compatible) —
JTAG Support IEEE 1149.1-1990 boundary-scan —
Process Technology [DATA_NEEDED: process node nm] 0.22 µm CMOS SRAM
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
System Gates — 200,000
Logic Cells — 9,984
Logic Array Blocks (LABs) — 1,248
User I/O Pins — 369
Core Voltage — 2.375 V to 2.625 V
Maximum Internal Frequency — 166.67 MHz
Embedded Memory (RAM bits) — 40,960 (via EABs)
Global Clock Networks — 4
Package — 484-Ball FineLine BGA (PBGA484)
Package Dimensions — 23 mm × 23 mm, 1.0 mm pitch
Configuration Method — SRAM, JTAG, EPC2 PROM
I/O Standards — 3.3 V LVTTL/LVCMOS, 5.0 V PCI
Status — Obsolete (last shipped 2007-2010, available via brokers)

Datasheets & Resources

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