EPF10K200SFC484-2X vs EPF10K200SFC484-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFC484-2X sa pamamagitan ng Intel at EPF10K200SFC484-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SFC484-2X EPF10K200SFC484-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Series FLEX 10KS FLEX-10KS
Family FLEX 10K FLEX 10K
Number of Logic Elements / Cells 9984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98304 —
Number of Gates 200000 (typical) —
Number of I/O 369 —
Core Voltage - Supply 2.375 V to 2.625 V —
Operating Frequency (max) 250 MHz (family-typical, -2 speed grade) —
Temperature na Operasyon 0C to +70C (commercial) 0 °C to +70 °C (Commercial)
Packhaging / Kaso 484-BBGA (FineLine BGA) —
Supplier Device Package 484-FBGA (23 x 23 mm, 1.0 mm pitch) —
Uri ng Pagpapasok Surface Mount Surface Mount
Technology CMOS, SRAM-based configuration —
Configuration Memory External serial (EPC1/EPC2 family compatible) —
JTAG Support IEEE 1149.1-1990 boundary-scan —
Process Technology [DATA_NEEDED: process node nm] 0.22 µm CMOS SRAM
Tindminan RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
System Gates — 200,000
Logic Cells — 9,984
Logic Array Blocks (LABs) — 1,248
User I/O Pins — 369
Core Voltage — 2.375 V to 2.625 V
Maximum Internal Frequency — 166.67 MHz
Embedded Memory (RAM bits) — 40,960 (via EABs)
Global Clock Networks — 4
Packhaging — 484-Ball FineLine BGA (PBGA484)
Package Dimensions — 23 mm × 23 mm, 1.0 mm pitch
Configuration Method — SRAM, JTAG, EPC2 PROM
I/O Standards — 3.3 V LVTTL/LVCMOS, 5.0 V PCI
Status — Obsolete (last shipped 2007-2010, available via brokers)

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