EPF10K200SFC484-2X vs EPF10K200SFC484-3 Comparación
Comparación detallada lado a lado de EPF10K200SFC484-2X por Intel y EPF10K200SFC484-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3 ObsoleteComparación de especificaciones
| Parámetro | EPF10K200SFC484-2X | EPF10K200SFC484-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $171,00 | $195,00 |
| Series | FLEX 10KS | FLEX-10KS |
| Family | FLEX 10K | FLEX 10K |
| Number of Logic Elements / Cells | 9984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98304 | — |
| Number of Gates | 200000 (typical) | — |
| Number of I/O | 369 | — |
| Core Voltage - Supply | 2.375 V to 2.625 V | — |
| Operating Frequency (max) | 250 MHz (family-typical, -2 speed grade) | — |
| Temperatura de funcionamiento | 0C to +70C (commercial) | 0 °C to +70 °C (Commercial) |
| Encapsulado / Carcasa | 484-BBGA (FineLine BGA) | — |
| Supplier Device Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Technology | CMOS, SRAM-based configuration | — |
| Configuration Memory | External serial (EPC1/EPC2 family compatible) | — |
| JTAG Support | IEEE 1149.1-1990 boundary-scan | — |
| Process Technology | [DATA_NEEDED: process node nm] | 0.22 µm CMOS SRAM |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| System Gates | — | 200,000 |
| Logic Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| User I/O Pins | — | 369 |
| Core Voltage | — | 2.375 V to 2.625 V |
| Maximum Internal Frequency | — | 166.67 MHz |
| Embedded Memory (RAM bits) | — | 40,960 (via EABs) |
| Global Clock Networks | — | 4 |
| Encapsulado | — | 484-Ball FineLine BGA (PBGA484) |
| Package Dimensions | — | 23 mm × 23 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM, JTAG, EPC2 PROM |
| I/O Standards | — | 3.3 V LVTTL/LVCMOS, 5.0 V PCI |
| Status | — | Obsolete (last shipped 2007-2010, available via brokers) |