EPF10K200SFC672-1X vs EPF10K200EFC672-2 Comparison
Detailed side-by-side comparison of EPF10K200SFC672-1X by Intel and EPF10K200EFC672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200SFC672-1X | EPF10K200EFC672-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $135.00 | $210.00 |
| Series | FLEX-10KS | β |
| Family | FLEX 10K (legacy) | FLEX 10KE |
| Architecture | Reconfigurable CMOS SRAM | β |
| Typical System Gates | 200,000 | β |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | β |
| Logic Elements (LEs) | 9,984 | β |
| Logic Array Blocks (LABs) | 1,248 | 624 |
| Embedded Array Blocks (EABs) | 24 | 12 |
| Embedded RAM Bits | 98,304 | β |
| User I/O Pins | 470 | β |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | β |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | β |
| Operating Temperature | 0 Β°C to 70 Β°C (Commercial) | 0 C to 70 C |
| Package | 672-ball FineLine BGA, 27 Γ 27 mm, 1.0 mm pitch | 672-BBGA (FineLine BGA) |
| Mounting Type | Surface Mount | β |
| Logic Family | CMOS | CMOS |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | β |
| Design Tool | Quartus (legacy FLEX 10K support) | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Logic Elements | β | 9,984 |
| Typical Gates | β | 200,000 |
| Maximum User I/Os | β | 470 |
| Embedded Memory | β | 98,304 bits |
| Package Dimensions | β | 45 x 45 mm |
| Ball Pitch | β | 1.27 mm |
| Process Technology | β | 0.22 um CMOS |
| Speed Grade | β | -2 |
| Supply Voltage (Core) | β | [DATA_NEEDED: core Vcc] |
| Programmability | β | JTAG (IEEE 1149.1) / in-system |