EPF10K200SFC672-1X vs EPF10K200EFC672-2 对比
详细并排对比 EPF10K200SFC672-1X 出自 Intel 和 EPF10K200EFC672-2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K200SFC672-1X | EPF10K200EFC672-2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $135.00 | $210.00 |
| Series | FLEX-10KS | — |
| Family | FLEX 10K (legacy) | FLEX 10KE |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 624 |
| Embedded Array Blocks (EABs) | 24 | 12 |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | — |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| 工作温度 | 0 °C to 70 °C (Commercial) | 0 C to 70 C |
| 封装 | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | 672-BBGA (FineLine BGA) |
| 安装类型 | Surface Mount | — |
| Logic Family | CMOS | CMOS |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Package Dimensions | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Process Technology | — | 0.22 um CMOS |
| Speed Grade | — | -2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |