EPF10K200SFC672-1X vs EPF10K200EFC672-2 Vergleich
Detaillierter Direktvergleich von EPF10K200SFC672-1X von Intel und EPF10K200EFC672-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200SFC672-1X | EPF10K200EFC672-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $135,00 | $210,00 |
| Series | FLEX-10KS | — |
| Family | FLEX 10K (legacy) | FLEX 10KE |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 624 |
| Embedded Array Blocks (EABs) | 24 | 12 |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | — |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| Betriebstemperatur | 0 °C to 70 °C (Commercial) | 0 C to 70 C |
| Gehäuse | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | 672-BBGA (FineLine BGA) |
| Montageart | Surface Mount | — |
| Logic Family | CMOS | CMOS |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Package Dimensions | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Process Technology | — | 0.22 um CMOS |
| Speed Grade | — | -2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |